PACK EXPO International 2026
The world’s largest packaging trade show, featuring solutions for food, beverage, and pharma.
Chicago, IL / McCormick Place, USA
Oct 18 – 21, 2026
Oct 18, 2026
About This Conference
The world’s largest packaging trade show, featuring solutions for food, beverage, and pharma.
Conference Dates
Oct 18 – 21, 2026
Abstract Deadline
Oct 18, 2026
Location
Chicago
Who Should Attend
- Researchers & Professors in Packaging / Processing / Manufacturing
- PhD Students & Early Career Scholars
- Industry Professionals in Packaging / Processing / Manufacturing
Key Topics in Packaging / Processing / Manufacturing
Attending in Chicago
Chicago is a vibrant academic and cultural hub in the United States, making it an excellent destination for conference attendees. Plan your travel early to take advantage of the best accommodation rates.
Quick Info
- City
- Chicago
- Country
- USA
- Event Format
- In-Person Event
- Duration
- 4 days
Present Your Research at PACK EXPO International 2026
Share your findings with leading Packaging / Processing / Manufacturing scholars. Submission deadline: October 18, 2026.
Abstract Deadline
Frequently Asked Questions
PACK EXPO International 2026 takes place from October 18, 2026 to October 21, 2026 in Chicago, IL / McCormick Place, USA.
The abstract submission deadline is October 18, 2026 (195 days remaining). Early submissions are encouraged as slots fill quickly.
This conference targets academic researchers, PhD students, postdoctoral scholars, and industry professionals working in Packaging / Processing / Manufacturing and related disciplines.
The conference covers a broad range of Packaging / Processing / Manufacturing themes including Innovation, Methodology, Scalability, Case Studies, Future Policy, and more.
PACK EXPO International 2026 is an in-person event held in Chicago, IL / McCormick Place. Attendees are encouraged to arrange travel and accommodation in advance.
To submit your research to PACK EXPO International 2026, visit the official conference website and follow the submission guidelines. Ensure your abstract meets the word limit and covers a topic relevant to Packaging / Processing / Manufacturing.
Event Details
- 📅 Start
- Oct 18, 2026
- 🏁 End
- Oct 21, 2026
- ⏰ Deadline
- Oct 18, 2026
- 📍 Location
- Chicago
- 🏷️ Field
- Packaging / Processing / Manufacturing
- 📝 Max Abstract
- 500 words
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